3D-Micromac invites you to SEMICON West 2020 – a new and exciting online event
We are going to present laser micromachining solutions that address critical needs of the semiconductor industry:
- microVEGA™ xMR – laser annealing system for monolithic magnetic sensor formation
- microPRO™ XS OCF – uv-lasersystem for ohmic contact formation in SiC power devices.
- microDICE™ – wafer dicing system using TLS-Dicing®
- microPREP™ PRO for laser-based sample preparation