Selective Laser Annealing for Ohmic Contact Formation (OCF)

The formation of ohmic contacts on the backside of SiC power devices plays a key role in defining their electrical characteristics and mechanical strength. Traditionally, thermal annealing has been used for ohmic contact formation, but the extremely high temperatures associated with this process can damage structures on the front side of wafers.

You can now watch our free webinar ”Selective Laser Annealing for Ohmic Contact Formation (OCF)” anytime online.

This webinar will cover the following topics:

• Thermal annealing vs. selective laser annealing
• Advantages for thin wafers
• 3D-Micromac’s Solution – microPRO™ XS for OCF

Laser-Based 3D-Magnetic Field Sensor Formation

You can watch our webinar on ”Laser-Based 3D-Magnetic Field Sensor Formation“ now online.

This webinar will cover the following topics:

• The growing importance of magnetic field sensors in technology
• A brief introduction of Giant Magneto Resistance Effect (GMR) and the Tunneling Restistance Effect (TMR)
• Selective laser annealing as a game-changer in sensor production
• microVEGA® for xMR – Insights into 3D Micromac’s industrial production solution