31. August – 04. September 2026

IMC21 2026

Die IMC21 ist die einzige globale Mikroskopiekonferenz, die Tausende von Delegierten, hochrangige Redner und Vertreter der nationalen Mikroskopieverbände zusammenbringt. Der Kongress vereint Fachleute, Mikroskopie-Verbände, politische Entscheidungsträger und Unternehmen, um die neuesten Erkenntnisse und bewährten Verfahren in der Mikroskopieforschung auszutauschen. Zu den Teilnehmern zählen Ingenieure, Wissenschaftler, Pädagogen und andere Mikroskopieexperten sowie Regierungsvertreter und Vertreter von IMC-Mitgliedsverbänden.

Wir präsentieren dort unser laserbasiertes Probenbearbeitungssystem microPREP PRO und freuen uns auf Ihren Besuch!

Sie finden uns am Messestand Nr. 328!

Veranstaltungsort:

ACC Liverpool, UK

Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis

Watch our free webinar on „Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis„

Join us for an insightful webinar where we will introduce a groundbreaking synergistic workflow, merging plasma Focused Ion Beam (FIB) technology with high-speed laser ablation using the 3D-Micromac microPREP® PRO. FIB technology, renowned for its precision and versatility, enables detailed imaging and precise material removal at the nanometer scale. When combined with high-speed laser ablation, this powerful integration significantly accelerates analysis processes and enhances precision.

In this webinar we will show general approaches for:

• Synergistic workflow combining plasma FIB technology and high-speed laser ablation technique (microPREP® PRO)
• Analysis process and enhanced precision of results
• Challenges in identifying defects buried deep under surfaces in advanced packaging technologies

Additionally, you get the latest update of the TESCAN Large Volume Workflow, developed in collaboration with industrial partners from the European FA4.0 project

• New shared sample holder compatible with various defect localization instruments
• Essence AutoSection™ software for automated sample holder alignment and ROI identification

Who Should Attend?

This webinar is ideal for professionals and users in the following fields:

• Semiconductor research and development
• Failure analysis and quality assurance
• Packaging technology
• High-tech industries requiring precise and fast analysis processes

Presenter: Lukas Hladik, Product Marketing Manager at TESCAN Group, has specialized in Plasma FIB-SEM and failure analysis solutions. His work is closely linked with the global semiconductor industry.

Femtosecond laser ablation-based preparation methods for high resolution materials characterization

Watch our free webinar on „Femtosecond laser ablation-based preparation methods for high resolution materials characterization“

Are you ready to revolutionize your specimen preparation processes? We are excited to announce a webinar featuring Dr. Tkadletz from Montanuniversität Leoben, who will explore the latest advancements in integrating modern specimen preparation equipment for transmission electron microscopy (TEM) and atom probe tomography (APT). This webinar will provide insights into how these modern specimen preparation techniques can significantly reduce complexity, improve efficiency, and facilitate faster and more effective investigations in materials research.

Our partner Rave Scientific is hosting the webinar.

Key Highlights:

• Cutting-Edge Integration: Discover how combining fs-laser ablation systems like the 3D-Micromac microPREP PRO FEMTO with focused (FIB) and broad (BIB) ion-beam polishing devices sets new standards in specimen preparation.
• Efficiency and Flexibility: Learn about the significant advantages of reduced effort, exceptional time efficiency, and flexibility in designing specimen geometries such as discs, half-grids, microtip arrays, and whole sample holders.
• Rapid Pre-Preparation: Understand how fs-laser ablation enables the rapid pre-preparation of TEM and APT specimens, often within minutes, streamlining the final preparation steps.
• Advanced Techniques: Explore the integration of complementary techniques like electron backscatter diffraction, energy dispersive X-ray spectroscopy, and FIB secondary ion mass spectroscopy for site-specific preparation.
• Eliminating Conventional Steps: See how modern techniques eliminate the need for FIB lift-outs and conventional dimple grinding, optimize materials research workflows, and enhance specimen throughput.

Speaker: Dipl.-Ing. Dr.mont. Michael Tkadletz (Chair of Functional Materials and Materials Systems, Montanuniversität Leoben, Austria)

19. – 20. Mai 2026

CAM-Workshop 2026

Am 19. und 20. Mai 2026 präsentieren wir uns mit unserem microPREP PRO System für die Probenvorbereitung auf dem 13. CAM-Workshop in Halle/Saale.

Der CAM-Workshop bringt Experten aus der Elektronikindustrie und Hersteller von Materialdiagnosegeräten zusammen. Ziel ist es, Herausforderungen, innovative Lösungen und zukünftige Anforderungen auf dem Gebiet der Fehleranalyse und Materialcharakterisierung von elektronischen Geräten, Sensoren und Systemen zu diskutieren.

Erfahren Sie alles über laserbasierte Probenbearbeitung für die Mikrostrukturdiagnostik bei einem Besuch auf unserem Messestand Nr. 001.

Wir freuen uns darauf, Sie an unserem Stand zu sehen!

Veranstaltungsort: Leibniz IAMO, Theodor-Lieser-Straße 2, Halle/SAALE

Stand: 001

Laser Glass Cutting of Waveguides for AR Devices

Watch our free webinar on „Laser Cutting for Separating Waveguides for AR Devices“

In this webinar, we show you:

• The first fully automated machine solution for cost-effective free-form cutting of high-index glass used for AR waveguides – developed in close cooperation with the SCHOTT AG
• How different process, handling, and quality inspection modules provide high flexibility and scalability in this laser micromachining solution
• How to optimize the laser process parameters and material compositions of high-index glasses

Laser Drilling of High-Precision Micro Holes

Learn more about the various laser drilling processes 3D-Micromac is capable of in our free webinar “Laser Drilling of High-Precision Micro Holes.” 

Laser microprocessing offers unmatched accuracy, versatility, speed, efficiency, and the ability to work with a wide range of materials and complex geometries.

It is a cornerstone technology in numerous industries where precision and quality are paramount.

Therefore, we focus on application examples in different materials in this webinar. We apply precision drilling in metal, polymer, and glass by:

📌 Percussion drilling and trepanning

📌 Flow Supported Laser Ablation – FSLA®

📌 Excimer laser ablation