Impact of Laser Sample Prep on Microstructure Diagnostics Workflows

Watch our free webinar on „Impact of Laser Sample Prep on Microstructure Diagnostics Workflows“

Discover how 3D-Micromac’s cutting-edge tools, microPREP PRO and microPREP PRO FEMTO, are enhancing sample preparation for researchers and diagnostic laboratories.

Why should you attend?

• Learn how to reduce sample preparation time from hours to minutes
• Explore the benefits of femtosecond laser technology for virtually damage-free sample preparation
• Understand how to prepare complex 3D-shaped samples for comprehensive analysis
• Gain insights into improving efficiency in APT, SEM, TEM, and XRM applications

Key highlights:

• Q&A session with Prof. Dr. Thomas Höche (Fraunhofer IMWS)
• Exclusive look at automated workflows for a wide range of sample prep tasks
• Discussion on laser machining of inorganic materials (metals, semiconductors, ceramics, glasses)

Speaker: Prof. Dr. Thomas Höche, Head of Business Unit Optical Materials and Technologies, Fraunhofer Institute for Microstructure of Materials and Systems IMWS

Don’t miss this opportunity to stay at the forefront of materials science innovation!

Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis

Watch our free webinar on „Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis„

Join us for an insightful webinar where we will introduce a groundbreaking synergistic workflow, merging plasma Focused Ion Beam (FIB) technology with high-speed laser ablation using the 3D-Micromac microPREP® PRO. FIB technology, renowned for its precision and versatility, enables detailed imaging and precise material removal at the nanometer scale. When combined with high-speed laser ablation, this powerful integration significantly accelerates analysis processes and enhances precision.

In this webinar we will show general approaches for:

• Synergistic workflow combining plasma FIB technology and high-speed laser ablation technique (microPREP® PRO)
• Analysis process and enhanced precision of results
• Challenges in identifying defects buried deep under surfaces in advanced packaging technologies

Additionally, you get the latest update of the TESCAN Large Volume Workflow, developed in collaboration with industrial partners from the European FA4.0 project

• New shared sample holder compatible with various defect localization instruments
• Essence AutoSection™ software for automated sample holder alignment and ROI identification

Who Should Attend?

This webinar is ideal for professionals and users in the following fields:

• Semiconductor research and development
• Failure analysis and quality assurance
• Packaging technology
• High-tech industries requiring precise and fast analysis processes

Presenter: Lukas Hladik, Product Marketing Manager at TESCAN Group, has specialized in Plasma FIB-SEM and failure analysis solutions. His work is closely linked with the global semiconductor industry.

Femtosecond laser ablation-based preparation methods for high resolution materials characterization

Watch our free webinar on „Femtosecond laser ablation-based preparation methods for high resolution materials characterization“

Are you ready to revolutionize your specimen preparation processes? We are excited to announce a webinar featuring Dr. Tkadletz from Montanuniversität Leoben, who will explore the latest advancements in integrating modern specimen preparation equipment for transmission electron microscopy (TEM) and atom probe tomography (APT). This webinar will provide insights into how these modern specimen preparation techniques can significantly reduce complexity, improve efficiency, and facilitate faster and more effective investigations in materials research.

Our partner Rave Scientific is hosting the webinar.

Key Highlights:

• Cutting-Edge Integration: Discover how combining fs-laser ablation systems like the 3D-Micromac microPREP PRO FEMTO with focused (FIB) and broad (BIB) ion-beam polishing devices sets new standards in specimen preparation.
• Efficiency and Flexibility: Learn about the significant advantages of reduced effort, exceptional time efficiency, and flexibility in designing specimen geometries such as discs, half-grids, microtip arrays, and whole sample holders.
• Rapid Pre-Preparation: Understand how fs-laser ablation enables the rapid pre-preparation of TEM and APT specimens, often within minutes, streamlining the final preparation steps.
• Advanced Techniques: Explore the integration of complementary techniques like electron backscatter diffraction, energy dispersive X-ray spectroscopy, and FIB secondary ion mass spectroscopy for site-specific preparation.
• Eliminating Conventional Steps: See how modern techniques eliminate the need for FIB lift-outs and conventional dimple grinding, optimize materials research workflows, and enhance specimen throughput.

Speaker: Dipl.-Ing. Dr.mont. Michael Tkadletz (Chair of Functional Materials and Materials Systems, Montanuniversität Leoben, Austria)

Laser Glass Cutting of Waveguides for AR Devices

Watch our free webinar on „Laser Cutting for Separating Waveguides for AR Devices“

In this webinar, we show you:

• The first fully automated machine solution for cost-effective free-form cutting of high-index glass used for AR waveguides – developed in close cooperation with the SCHOTT AG
• How different process, handling, and quality inspection modules provide high flexibility and scalability in this laser micromachining solution
• How to optimize the laser process parameters and material compositions of high-index glasses

Laser Drilling of High-Precision Micro Holes

Learn more about the various laser drilling processes 3D-Micromac is capable of in our free webinar “Laser Drilling of High-Precision Micro Holes.” 

Laser microprocessing offers unmatched accuracy, versatility, speed, efficiency, and the ability to work with a wide range of materials and complex geometries.

It is a cornerstone technology in numerous industries where precision and quality are paramount.

Therefore, we focus on application examples in different materials in this webinar. We apply precision drilling in metal, polymer, and glass by:

📌 Percussion drilling and trepanning

📌 Flow Supported Laser Ablation – FSLA®

📌 Excimer laser ablation

Design & Fabrication of Ultra-Sensitive Magnetic Sensors

SEMI continues its Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.

These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device?  Then this is the webinar series for you.

Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.

This webinar consists of two presentations:

Wafer Fabricated Atomic Reference Cells

Tom Kornack, Chief Scientist, Twinleaf LLC

Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.

Laser Based Magnetic Field Sensor Formation for GMR / TMR Sensor Arrays

Dr. Dirk Lewke, Team Leader Technology Innovation Management, 3D-Micromac

This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.