Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis
Watch our free webinar on „Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis„
Join us for an insightful webinar where we will introduce a groundbreaking synergistic workflow, merging plasma Focused Ion Beam (FIB) technology with high-speed laser ablation using the 3D-Micromac microPREP® PRO. FIB technology, renowned for its precision and versatility, enables detailed imaging and precise material removal at the nanometer scale. When combined with high-speed laser ablation, this powerful integration significantly accelerates analysis processes and enhances precision.
In this webinar we will show general approaches for:
- Synergistic workflow combining plasma FIB technology and high-speed laser ablation technique (microPREP® PRO)
- Analysis process and enhanced precision of results
- Challenges in identifying defects buried deep under surfaces in advanced packaging technologies
Additionally, you get the latest update of the TESCAN Large Volume Workflow, developed in collaboration with industrial partners from the European FA4.0 project
- New shared sample holder compatible with various defect localization instruments
- Essence AutoSection™ software for automated sample holder alignment and ROI identification
Who Should Attend?
This webinar is ideal for professionals and users in the following fields:
- Semiconductor research and development
- Failure analysis and quality assurance
- Packaging technology
- High-tech industries requiring precise and fast analysis processes
Presenter: Lukas Hladik, Product Marketing Manager at TESCAN Group, has specialized in Plasma FIB-SEM and failure analysis solutions. His work is closely linked with the global semiconductor industry.
